ACID & ALKALI
Exceptional resistance to aggressive chemicals, including concentrated acids and strong oxidizing agents.
Technical specifications for Halar® ECTFE (Ethylene Chlorotrifluoroethylene) coatings. Specialized high-purity chemical barrier protection for industrial process equipment in Mumbai.
Chemical Resilience
Exceptional resistance to aggressive chemicals, including concentrated acids and strong oxidizing agents.
Offers a dense molecular structure that prevents gas and vapor penetration.
Extremely smooth surface prevents bacterial growth and contamination in sensitive sectors.
Halar application requires precise thermal management. We utilize advanced electrostatic powder systems to achieve thick, pinhole-free barriers. The sintering process is conducted in electronically controlled ovens to ensure uniform fusion of the ECTFE particles into a continuous protective barrier.
Technical answers regarding Halar ECTFE application, substrate preparation, and performance limits.
We grit blast the metal substrate to a near-white metal finish (SSPC-SP10 / NACE No. 2) to achieve a sharp, angular surface profile of 50 to 75 microns (2.0 to 3.0 mils). Proper profile is critical; without it, the thermoplastic Halar polymer will experience shear-induced delamination during thermal expansion cycles.
For chemical immersion service (such as pharmaceutical reactors or acid scrubbers), we conduct wet spark testing (holiday detection) using high-voltage DC spark testers per ASTM D5162. The voltage is calibrated to the dry film thickness (typically 100 to 125 volts per mil of coating thickness) to identify micro-porosities without damaging the fused polymer matrix.
Halar ECTFE provides continuous thermal stability up to 150°C (300°F). However, in contact with strong oxidizers like hot concentrated nitric acid or wet chlorine gas, the service limit should be derated to 120°C to prevent oxidative degradation and chemical permeation of the lining.
Cast iron can be coated provided it undergoes thermal outgassing (pre-heating at 300°C) to release trapped air pockets within the porous casting that would cause blistering. Copper-base alloys cannot be coated directly because copper accelerates the thermal degradation of the ECTFE resin during the 275°C sintering cycle. An intermediate nickel or stainless steel plating barrier is required.
For protective barrier coatings, the target dry film thickness (DFT) is typically between 600 to 1000 microns. We achieve a nominal tolerance of ±10% using electronic magnetic-induction gauge systems calibrated per ASTM D7091.
Deploy Halar ECTFE to protect your most critical chemical processing equipment.